收藏本站
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
SHDN
SHDN is located in the center of the bump layout of the
MAX2240. Therefore, the SHDN line requires the use of
either a via to a buried line or a trace that fits inside a
10-mil gap between solder pads to bring out a connec-
tion from SHDN .
D0, D1 Pins
Digital power control inputs D0 and D1 have CMOS-
logic level inputs. As in any PC board circuit, the length
of the logic signal traces determines the susceptibility
to high-frequency noise that can interfere with normal
switching. Therefore, in some cases, it can be neces-
sary to provide some local lowpass filtering of the logic
traces to suppress HF noise coupling to these inputs.
Output Match Layout
It is possible to lay out the output matching network
transmission traces in a more compact manner if PC
board area is limited. Series lines T1 and T2 can be
constructed as folded lines, though it can be necessary
to chamfer the corners for wide lines.
Prototype Chip Installation
Alignment keys on the PC board around the area where
the chip is located are helpful in the prototype assembly
process. The MAX2240 EV kit PC board has L-shaped
alignment keys at the diagonal corners of the chip. It is
better to align the chip on the board before any other
components are placed, and then place the board on a
hotplate or hot surface until the solder starts melting.
Remove the board from the hotplate without disturbing
the position of the chip, and let it cool down to room tem-
perature before processing the board further.
Table 2. Reliability Test Data
UCSP Reliability
The UCSP represents a unique packaging form factor that
may not perform equally to a packaged product through
traditional mechanical reliability tests. CSP reliability is
integrally linked to the user’s assembly methods, circuit
board material, and usage environment. The user should
closely review these areas when considering use of a CSP
package. Performance through Operating Life Test and
Moisture Resistance remains uncompromised as it is pri-
marily determined by the wafer-fabrication process.
Mechanical stress performance is a greater consideration
for a CSP package. CSPs are attached through direct sol-
der contact to the user’s PC board, foregoing the inherent
stress relief of a packaged product lead frame. Solder
joint contact integrity must be considered. Table 2 shows
the testing done to characterize the CSP reliability perfor-
mance. In conclusion, the UCSP is capable of performing
reliably through environmental stresses as indicated by
the results in the table. Additional usage data and recom-
mendations are detailed in the UCSP application note,
which can be found on Maxim’s web- site at www.maxim-
ic.com.
Users should also be aware that, as with any interconnect
system, there are electromigration-based current limits
that, in this case, apply to the maximum allowable current
in the bumps. Reliability is a function of this current, the
duty cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings section for any specific limita-
tions, listed under Continuous Operating Lifetime.
TEST
Temperature Cycle
Operating Life
Moisture Resistance
Low-Temperature Storage
Low-Temperature
Operational
Solderability
ESD
High-Temperature Operating
Life
CONDITIONS
-35 ° C to +85 ° C,
-40 ° C to +100 ° C
T A = +70 ° C
+20 ° C to +60 ° C, 90% RH
-20 ° C
-10 ° C
8hr steam age
± 2000V, Human Body Model
T J = +150 ° C
DURATION
150 cycles,
900 cycles
240hr
240hr
240hr
24hr
—
—
168hr
NO. OF FAILURES PER
SAMPLE SIZE
0/10,
0/200
0/10
0/10
0/10
0/10
0/15
0/5
0/45
8
____________________________________________________________________________________________________
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
MAX2240EVKIT EVAL KIT MAX2240
MAX2242EVKIT EVAL KIT MAX2242
MAX2247EBC+T IC AMP POWER 2.4GHZ 12-UCSP
MAX2265EVKIT EVAL KIT
MAX2309EVKIT EVAL KIT
MAX2320EUP+T IC LNA/MIXER SIGE ADJ 20TSSOP-EP
MAX2323ETI+T IC LNA/MIXER SIGE ADJ 28-TQFN
MAX2335ETI+ IC LNA/MIXER CDMA/OFDM 28TQFN-EP
相关代理商/技术参数
MAX2240EBL+TW 制造商:Maxim Integrated Products 功能描述:RF AMP CHIP SGL PWR AMP 2.5GHZ 5V 9UCSP - Tape and Reel
MAX2240EBL+W 制造商:Maxim Integrated Products 功能描述:2.5GHZ, +20DBM POWER AMPLIFIER IC IN UCSP PACKAGE - Rail/Tube
MAX2240EBL-T 功能描述:射频放大器 2.5GHz +20dBm Power Amplifier RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel
MAX2240EPL 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Amplifier. Other
MAX2240EVKIT 功能描述:放大器 IC 开发工具 MAX2240 Eval Kit RoHS:否 制造商:International Rectifier 产品:Demonstration Boards 类型:Power Amplifiers 工具用于评估:IR4302 工作电源电压:13 V to 23 V
MAX2242 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:2.4GHz to 2.5GHz Linear Power Amplifier
MAX2242CCM 制造商:Maxim Integrated Products 功能描述:
MAX2242EBC 制造商:Maxim Integrated Products 功能描述:12 PIN COUNT UCSP PACKAGE TYPE - Bulk